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filingDate 2011-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94eacea30ef8cfd205c3d5683554715c
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publicationDate 2015-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8951816-B2
titleOfInvention Film forming method
abstract One embodiment of the present invention is a film forming method comprising: arranging a surface of a film formation substrate 10 including an absorption layer 12 on a first substrate 11 and a material layer 13 containing a film formation material and a surface of a film-formation target substrate 20 including a first layer 23 over a second substrate 22 , so as to face each other; forming a second layer 13 a containing the film formation material over the first layer 23 by performing first heat treatment on the material layer 13 ; and forming a third layer 13 b containing the film formation material over the second layer 13 a by performing second heat treatment on the material layer 13 . In the second heat treatment, energy with a density higher than that in the first heat treatment is applied to the material layer.
priorityDate 2010-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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