| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f87ad6ccd1a371abeb8d2d88874f5abf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f3d814b1d58ff0fb9d58f6d0e8a53a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7619c6cf796736aef4021dc689fe047f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58d71fa8ee977be1e29d5d23359ec5cb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1536
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0394
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-462 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2010-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da836c34131d8160fb2d75834f8435eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acc96f414bb27a0d1ca8bce30bf6943c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a271b2c1575299a320328320af66fe8e |
| publicationDate |
2015-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8950063-B2 |
| titleOfInvention |
Methods of manufacturing printed circuit boards with stacked micro vias |
| abstract |
A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107613657-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015041428-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9485876-B2 |
| priorityDate |
2006-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |