| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f606ac7b2767fa8c5c885171d5e12943
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10371
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09845 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1021 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 |
| filingDate |
2011-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_958d53ba033d0ef6c50ce823aefb495c |
| publicationDate |
2015-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8941017-B2 |
| titleOfInvention |
Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus |
| abstract |
An electronic apparatus includes: a substrate which has a step portion in an edge portion; an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate; and a cap member which is bonded to the step portion so as to seal the electronic component, wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020203905-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11777266-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020015372-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10448530-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10122394-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017359093-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10939567-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11146030-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11552436-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10622770-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11101609-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019027875-A1 |
| priorityDate |
2010-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |