| abstract |
A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate ( 1 ) with at least one functional layer ( 22 ), applying at least one first barrier layer ( 3 ) on the functional layer ( 22 ) by means of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer ( 4 ) on the functional layer ( 22 ) by means of plasma-enhanced chemical vapor deposition (PECVD). |