| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47d1d3d7420227300d527f2522bb9f22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_15c9220a3f8e60678c4f8b59b8aa7ac4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d133e5594f9e2e77d654be29c12543f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b7619e5f42c0481cfac593dbedc45a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9b4565943780dbabf46d8d76fdd28dc6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9b45744f2c0f2cc4759af1ffbbd6cb3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2010-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6059399ab7bf930db25467192f55782d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_868f535e358d18ae14321fdcf7fa2e5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbb395a75f71b89fa9998c5513af8378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_613eecf411749b17bee53af61668317b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22eccedfac6340a1c98c5f3a0afac599
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5b072ff613ea75f6988305e7e3e3f08 |
| publicationDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8912658-B2 |
| titleOfInvention |
Interconnect structure with enhanced reliability |
| abstract |
An improved interconnect structure including a dielectric layer having a conductive feature embedded therein, the conductive feature having a first top surface that is substantially coplanar with a second top surface of the dielectric layer; a metal cap layer located directly on the first top surface, wherein the metal cap layer does not substantially extend onto the second top surface; a first dielectric cap layer located directly on the second top surface, wherein the first dielectric cap layer does not substantially extend onto the first top surface and the first dielectric cap layer is thicker than the metal cap layer; and a second dielectric cap layer on the metal cap layer and the first dielectric cap layer. A method of forming the interconnect structure is also provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9812390-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016260667-A1 |
| priorityDate |
2010-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |