| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d024ff33215ba00c988d5a3210d223e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86163600c8c4e0c4e61f231765ae06e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e8d1e352e822add01a8d88428196d98e |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01011
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-20
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-211
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
| classificationCPCInventive |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
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| classificationIPCAdditional |
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| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc307e01beabcc7bb76710fb46936df7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb2b8142979cd73c143bee74125e16f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77f7a8ea009739325f38345bcfe3db19 |
| publicationDate |
2014-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8901725-B2 |
| titleOfInvention |
Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
| abstract |
A wiring board has a structure where multiple wiring layers are stacked one on top of another with insulating layers interposed therebetween. A sheet-shaped member is buried in an outermost insulating layer located on a side of the structure opposite to a side on which a semiconductor element is to be mounted. The sheet-shaped member has a modulus of elasticity and a coefficient of thermal expansion which are similar to a modulus of elasticity and a coefficient of thermal expansion of the semiconductor element. The sheet-shaped member is made of a material having a modulus of elasticity and a coefficient of thermal expansion which are enough to bring respective distributions thereof into a substantially symmetric form in a direction orthogonal to a surface of the wiring board in the case where the semiconductor element is mounted. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016057863-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10098228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743351-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10383228-B2 |
| priorityDate |
2010-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |