| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66b10f1652b342784cdf266e9171cf61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ddc47c5b549579ee9efe4f4f9725742a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3b12867d1c66b8bf270062cd37f3b31f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ac3d5a18f510cf9efca588e25ad93d8 |
| classificationCPCAdditional |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05558
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1306
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13006
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f72aef2824b9a44df37493bf8066cef3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52d31e63b1c28b6b68001d016fbaffcd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6968255ea29aaac11e5f2613b7f8176a |
| publicationDate |
2014-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8895430-B2 |
| titleOfInvention |
Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps |
| abstract |
A semiconductor device has a semiconductor wafer with a plurality of semiconductor die including a plurality of contact pads. An insulating layer is formed over the semiconductor wafer and contact pads. An under bump metallization (UBM) is formed over and electrically connected to the plurality of contact pads. A mask is disposed over the semiconductor wafer with a plurality of openings aligned over the plurality of contact pads. A conductive bump material is deposited within the plurality of openings in the mask and onto the UBM. The mask is removed. The conductive bump material is reflowed to form a plurality of bumps with a height less than a width. The plurality of semiconductor die is singulated. A singulated semiconductor die is mounted to a substrate with bumps oriented toward the substrate. Encapsulant is deposited over the substrate and around the singulated semiconductor die. |
| priorityDate |
2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |