| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_827f58bacb8fef905977e1f8b3c7aace
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_acd227f3cb372db661c09cce533184dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-115 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2012-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26825c59bff7418803b63e2bd0750824 |
| publicationDate |
2014-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8853843-B2 |
| titleOfInvention |
Modular low stress package technology |
| abstract |
A semiconductor subassembly, a modular sidewall element having modular dimensions that accommodates placement of the semiconductor subassembly in a modular layout and a semiconductor substrate base element coupled to the modular sidewall element. The semiconductor substrate base element has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element and the semiconductor substrate base element configured to form a base of the semiconductor subassembly. |
| priorityDate |
2009-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |