| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dbfc6be1c00f54fec669bd0d04225ec8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_67b8c3f2ab6531c9ba39ca379b99344c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc8391627fc41fa2829364fcc1a91559 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10159
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249994 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F13-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-084 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2011-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8adeeadd8be43f996a6a1442481665b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d05b876144dacc1b29c7ab3b2ad30e4 |
| publicationDate |
2014-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8837151-B2 |
| titleOfInvention |
Memory modules including compliant multilayered thermally-conductive interface assemblies |
| abstract |
According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9222735-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10359812-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10287471-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11335621-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10802546-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10781349-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10501671-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11617284-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11041103-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11072706-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9374932-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014376191-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10312177-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109729699-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10155894-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886193-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11373921-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10174433-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10428257-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10428256-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10952352-B2 |
| priorityDate |
2009-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |