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publicationDate 2014-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8828755-B2
titleOfInvention Light-emitting element package and fabrication method thereof
abstract A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.
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