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filingDate 2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2014-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8816499-B2
titleOfInvention Electrical interconnections of semiconductor devices and methods for fabricating the same
abstract Provided are electrical interconnections and methods for fabricating the same. The electrical interconnection may include a substrate including a bonding pad, a solder ball electrically connected to the bonding pad, a solder supporter on the bonding pad, a portion of the solder ball filling the solder supporter, and a metal layer between the bonding pad and the solder supporter, the metal layer having an ionization tendency lower than the bonding pad.
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