Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ba69ee9d664aded61c93aa9e5399c74a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2281ad075880b37d8223682a420b2f3b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24137 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02N1-008 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-82 |
filingDate |
2008-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2014-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d1bf934673e7e8907261dbb1236bed1 |
publicationDate |
2014-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8815653-B2 |
titleOfInvention |
Packaging and connecting electrostatic transducer arrays |
abstract |
Embodiments of a method for packaging cMUT arrays allow packaging multiple cMUT arrays on the same packaging substrate introduced over a side of the cMUT arrays. The packaging substrate is a dielectric layer on which openings are patterned for depositing a conductive layer to connect a cMUT array to VO pads interfacing with external devices. Auxiliary system components may be packaged together with the cMUT arrays. Multiple cMUT arrays and optionally multiple auxiliary system components can be held in place by a larger support structure for batch production. The support structure can be made of an arbitrary size using inexpensive materials. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10613058-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10618078-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10399121-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10413938-B2 |
priorityDate |
2007-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |