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publicationDate 2014-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8765595-B2
titleOfInvention Thick on-chip high-performance wiring structures
abstract Methods for fabricating a back-end-of-line (BEOL) wiring structure, BEOL wiring structures, and design structures for a BEOL wiring structure. The BEOL wiring may be fabricated by forming a first wire in a dielectric layer and annealing the first wire in an oxygen-free atmosphere. After the first wire is annealed, a second wire is formed in vertical alignment with the first wire. A final passivation layer, which is comprised of an organic material such as polyimide, is formed that covers an entirety of a sidewall of the second wire.
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