| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eec3b1e806f1e5cd1d17e41546cddd33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73bda94284c61d3b9aea06a8322ea594
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a98507980ab01953f8a22b7fc0dc3976
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bbd231b53ed89e9b690372385e5ee9ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4b6c4fb49811d0aecf91514b5e1ccdf4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_222758f94ccc9369545661534a704b5e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0543
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-362 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-04 |
| filingDate |
2012-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41067df19d471fdb0dd76a6ff08bf696
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f88cf2b2756777a8058367130a93a8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d37a4b291d967d7b2beeea3116ffe9ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3227dcb47c0d1e5b87633b35db1af941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4238c13eff29d1620b83667f579eff05 |
| publicationDate |
2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8738149-B2 |
| titleOfInvention |
Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device |
| abstract |
The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer. n The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate. n The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10702700-B2 |
| priorityDate |
2007-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |