| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a995dffa047434fa21c7e08fe58a3ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e968e5de078c04680e2633c2bb9d37ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a424034d7faf3fe11efbb1735b6c7c2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_482a90393c83d90cb4d6244cb2e325af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d42d6ca4641b20d2c090d6bee4fa47ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_71cd4059fe29d9cb0e8be7ab43dbd29b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f9471aad38925aea2d8f98b165919e5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22 |
| filingDate |
2011-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60e58ed1eadf7c5483f881efd4099c7e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5217ae263765307feac40a665b85ad4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2996c87de959aa7463b088cfb9a8ee50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_671654366bdec7e3c5b79212e250d32d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61e75888388e255071cec459382affcf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e25c3972cbfb4d8d0ce48f77a0e2780
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23125b7c5ba25dab701961da98769843 |
| publicationDate |
2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8734665-B2 |
| titleOfInvention |
Slurry for chemical-mechanical polishing of copper and use thereof |
| abstract |
A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol, a controlled amount of chloride ion source and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad. |
| priorityDate |
2011-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |