http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8716592-B2

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0463
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-142
filingDate 2004-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de629726ab3933a3b8e07b523f2d251b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7bbdd328e258f8f2b4ff33a6f8f6cfd1
publicationDate 2014-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8716592-B2
titleOfInvention Thin film photovoltaic assembly method
abstract The present invention relates to a method of manufacturing thin film photovoltaic panels (TFPP). Instead of utilizing a conventional EVA based adhesive layer, material, the present invention uses an adhesive layer that may be applied in a liquid form and cures rapidly to form the TFFP. In one embodiment, the method provides for applying an adhesive layer in a liquid form along at least a portion of the exposed photovoltaic layer and substrate. In another embodiment, the method provides for applying a first layer adhesive in liquid form along at least one edge of the substrate and second layer of adhesive in liquid form generally bound by the first layer of adhesive. After application of the adhesive layer(s), a force may then be applied to adhere the front panel (or substrate), photovoltaic material layer, adhesive layer and backing panel and the adhesive layer transforms from a liquid to a solid.
priorityDate 2004-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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