http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8709325-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_792b861055c17d631b0076f0e3918a17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c9458537e4e831604fe551e999979f2c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2023-0683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-7207 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0807 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0001 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-00 |
| filingDate | 2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44b0a1d5bdd32293d73126bd9e8df61f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cd4a5a7a1846caeab44773d2e1d5622 |
| publicationDate | 2014-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-8709325-B2 |
| titleOfInvention | Liquid low temperature injection molding process |
| abstract | The molding method of the invention is a low-temperature, liquid-phase, injection molding process using an externally heated mold. This molding process is ideally suited for production of limited quantities of molded parts, as comparatively low cost molds can be used. The molding composition used in the invention is a mixture of a carrier and binder component and a powdered polyethylene component. The carrier and binder component can be a very low density polyethylene, petroleum jelly, hydrocarbon waxes, liquid hydrocarbon oils, or mixtures thereof. The powdered polyethylene component is finely subdivided polyethylene, preferably ultra high molecular weight, having a low melt index, at least no greater than 30. The carrier and binder component is used in sufficient quantity to provide a thixotropic mixture with a consistency of toothpaste, typically having a stirred viscosity up to 30,000 centipoise at the injection temperature of the molding process. Since the process utilizes a mold which is externally heated, it can be controlled to provide minimal heating of the core of the part, thereby permitting one to incorporate components within the part without damage to temperature sensitive elements in the components. |
| priorityDate | 2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.