http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8703584-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d2fe766303882389d2d3ccf5aeff886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4f3444237ad01d458671d193600cc372 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate | 2010-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_445aca85e5a98952869d058eb2e09166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a6197881c76efc930b7993ff3ad2983 |
| publicationDate | 2014-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-8703584-B2 |
| titleOfInvention | Dicing tape-integrated film for semiconductor back surface |
| abstract | The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a multilayered structure including a wafer adhesion layer and a laser mark layer, the wafer adhesion layer is formed of a resin composition containing a thermosetting resin component and, as an optional component, a thermoplastic resin component in an amount of less than 30% by weight relative to the whole amount of resin components, and the laser mark layer is formed of a resin composition containing a thermoplastic resin component in an amount of 30% by weight or more relative to the whole amount of resin components and, as an optional component, a thermosetting resin component. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9362105-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013196472-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9281182-B2 |
| priorityDate | 2009-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 207.