| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_97108a4a812864d40a70fece009ffe30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_215150aa64d39392f730ebd62f167a64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d127ae5e259266c861169619498f2de2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2009-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c2064077254cfd1012fba619de6c7c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_605fb43dffb227a9ca985f8369f7430b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d9b325ec09b2437253fb5eb8932fd3d |
| publicationDate |
2014-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8697574-B2 |
| titleOfInvention |
Through substrate features in semiconductor substrates |
| abstract |
Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a first region of a semiconductor substrate. A through substrate conductor coil is disposed in a second region of the semiconductor substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10297657-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017373133-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018247762-A1 |
| priorityDate |
2009-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |