Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5701aeff9516d9ccc3f27e270b991354 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e2f011a280772e27c1d5692fd058dcce http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9a9aad45e5465bd5d3e7e503b2b16c65 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1b74c9d342b66a0d2b94c386b028a31a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-6656 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-6659 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7848 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823807 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28518 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823814 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-665 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
filingDate |
2007-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2014-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1284ddc85e9bbf5f24791bb4d6c6125c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01d468505824a8ddc8d2f32c67873aa5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a058b0ac0ee7075bae02ff3a048908d |
publicationDate |
2014-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8679973-B2 |
titleOfInvention |
Method of manufacturing semiconductor device |
abstract |
The method of manufacturing the semiconductor device comprises forming a transistor including a gate electrode and a source/drain diffused layer over a semiconductor substrate, forming a nickel platinum film over the semiconductor substrate, covering the gate electrode and the source/drain diffused layer, making a first thermal processing to react the nickel platinum film with the source/drain diffused layer to form a nickel platinum silicide film, and removing an unreacted part of the nickel platinum film using a chemical liquid of 71° C. or more containing hydrogen peroxide. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9842738-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9249497-B2 |
priorityDate |
2006-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |