| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_46e7a8dad1db0c1243b0f4db7f250b26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bd6782a5dc6c6e223fb02d763e7e62f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee7783a528db04c54068de287cce1447 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20 |
| filingDate |
2012-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e67941dd5d7374dde20011a391822d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9412f333f90cca7acb2d675effd2585d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d160658f255f7445c529de9e83fa5bcf |
| publicationDate |
2014-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8659157-B2 |
| titleOfInvention |
Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device |
| abstract |
An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more. |
| priorityDate |
2011-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |