| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99cf6c4dead4a2f5ce61993e3bdf15ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c50ca0e6a22787f64a45dff5b2520234
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bb3a8f9bf2ec84d5c62aea3c588346ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d9f4e1bd71b74c3f179103695f5a514
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C25-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00 |
| filingDate |
2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bad34a0ad1a4615de8e47900e1ba9c48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e70e64507a374c1ef7616696f8fa371e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fcf46e2d780970b846024d37727af5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fdb5dcb03c74a34e557e95a9fef4505 |
| publicationDate |
2014-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8623231-B2 |
| titleOfInvention |
Method for etching an ultra thin film |
| abstract |
A method for etching an ultra thin film is provided which includes providing a substrate having the ultra thin film formed thereon, patterning a photosensitive layer formed over the ultra thin film, etching the ultra thin film using the patterned photosensitive layer, and removing the patterned photosensitive layer. The etching process includes utilizing an etch material with a diffusion resistant carrier such that the etch material is prevented from diffusing to a region underneath the photosensitive layer and removing portions of the ultra thin film underneath the photosensitive layer. |
| priorityDate |
2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |