| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40097cb539d574cbb5aa82eb13af97da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_05f8f1741c4eb43c484aa1ec8c5375dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c2eaaed331294280224c3e9c9b828eb4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_508b896d2f47806af5e9edb09607a1fe |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01018 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2011-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc26ff24843ca4fb9effe7ef57858af5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_247f228e6f5c6fa56eb06c9d5faef8fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8acced8ed220fe998a64bfd48097bc0 |
| publicationDate |
2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8618420-B2 |
| titleOfInvention |
Apparatus with a wire bond and method of forming the same |
| abstract |
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013062102-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9055700-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011253429-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11786930-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013033825-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8995146-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013249258-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11679412-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11393679-B2 |
| priorityDate |
2008-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |