Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af218e647bc968bed57daf4bf9abf73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8b5407aa936b81f88838e9dd72836c99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_234163d4b88e036be84f952fcab7973c |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2982 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-18 |
filingDate |
2009-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b202a6ae51333290a322f3be3b4f4483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ee5075ce4e7bfdad9a2b12adc023789 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08b3d001008831892d78f41f25e234f0 |
publicationDate |
2013-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8592504-B2 |
titleOfInvention |
Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material |
abstract |
A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20. |
priorityDate |
2008-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |