| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2ad6b38b8a1c93b6a2d16feac48254fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d1a65ddebcb201a9aa2d0eeda0c7884
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_333e3a87d62ec421f3c4c0e468b7fe92 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
2007-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98e110aa61014a7c27b8f84a5783d5fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e09b53ac67115102b4a14d5134c4387e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9072c619b6fb3c21db4ef3577e138f25 |
| publicationDate |
2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8580913-B2 |
| titleOfInvention |
Polyimide resin |
| abstract |
A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. n The polyimide resin is a polyimide resin containing a molecule having a repeating unit represented by a structure of any one of the following formulae (1) to (3) in a specified proportion, whose molecular end is capped by an end-capping agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009305046-A1 |
| priorityDate |
2006-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |