| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a950b24cf75edc7fcddff02e9f6fc45b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-097 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2011-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ef1c1218f4907327aa8fd44103d0bea |
| publicationDate |
2013-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8569090-B2 |
| titleOfInvention |
Wafer level structures and methods for fabricating and packaging MEMS |
| abstract |
Methods of fabricating a Micro-Electromechanical System (MEMS) in a hermetically sealed cavity formed at a substrate level are provided. Generally, the method comprises: (i) forming a number of first open cavities in a surface of a first substrate and a number of second open cavities in a surface of a second substrate corresponding to the first open cavities; (ii) forming an actuator/sensor layer including a number of MEMS devices with electrically conductive regions therein; (iii) bonding the first substrate and the second substrate to the actuator/sensor layer so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices to form a sealed cavity around the MEMS; and (iv) electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect. Other embodiments are also described. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11579033-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11674803-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015191345-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10273147-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11675186-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10071905-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11712637-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10131540-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10768065-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016264402-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020033591-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10377625-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11230375-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105967137-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105967137-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018172530-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10118696-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10209155-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10407299-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9309106-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11287486-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9254992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10392244-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10214414-B2 |
| priorityDate |
2010-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |