Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d2fe766303882389d2d3ccf5aeff886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bd6782a5dc6c6e223fb02d763e7e62f8 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-5448 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1467 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-40 |
filingDate |
2012-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_292af66d0796ea0d948bc0a47246926c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5be51c9e2cfa4e1d5cc2d0585d4367d3 |
publicationDate |
2013-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8558397-B2 |
titleOfInvention |
Dicing tape-integrated wafer back surface protective film |
abstract |
The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8841780-B2 |
priorityDate |
2009-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |