| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_72dd6290a90c6f57ae371400354ac2de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b0b6c68ede0eb8fe9480777b2813fba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_652769fe685655c330345341b55122f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0823c7c859442bf6df6a283bb446af56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c4b694750e54d95f57b4e85c096793eb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2012-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c0f1bde6bdbc4894d3c6d4d77746889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47e9761560238c9766649ea5300fb74d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33ffc201c6666f0431d7ab261c5effbb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e2fe416bdc012dbb2d55392a816d2eb |
| publicationDate |
2013-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8557006-B2 |
| titleOfInvention |
Chemical mechanical polishing slurry, its preparation method and use for the same |
| abstract |
A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10964551-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9437453-B2 |
| priorityDate |
2006-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |