| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48a83c5dddf8d0d630877393ab391afe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8700fc72e59d410b66cc0665462d50a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7436824cb6abcbb3b3d6a52c3191325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_664f5b543543aac4cf0153a4ef4e0f85 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2110-0066 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-7621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-00 |
| filingDate |
2009-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12a2dbd6c8c6580fb2fcd7a8213e5d19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09f76faf8b940f55bdeb61db9d7828bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1039e232e300eca31f7a3a1b82896813 |
| publicationDate |
2013-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8551201-B2 |
| titleOfInvention |
Polyurethane composition for CMP pads and method of manufacturing same |
| abstract |
Polyurethane composition based on a certain polyether and polyester prepolymer reaction mixture, wherein the composition is utilized in manufacturing chemical mechanical polishing/planarizing (CMP) pads. The CMP pads have low rebound and can dissipate irregular energy as well as stabilize polishing to yield improved uniformity and less dishing of the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012238655-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9023909-B2 |
| priorityDate |
2009-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |