| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_efc42e81c03eee94c8bb802d1def933d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_978b05e5eb8d16880c91f7de282e41cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d6f7da1e425c8a3ef1da21e08f4c196
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8eb65b1c274fe34d5cfd48a9421fb9cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7d7d9ded4c51263fbbf7805fb2f5ce6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y15-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01Q70-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01Q70-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y40-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01Q60-38 |
| filingDate |
2012-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0084da8af7f88846266f9485d25a3738
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20f2d46bcf3c19926097e13163c63661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49e2059adb35963b03dfc0b535746862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8838d575cda922822f3e31d1c12116b |
| publicationDate |
2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8539611-B1 |
| titleOfInvention |
Scanned probe microscopy (SPM) probe having angled tip |
| abstract |
A method of creating a probe for scanned probe microscopy is disclosed. The method includes providing a wafer having a support wafer layer and a device layer. The method includes masking the wafer with a masking layer. The method includes removing a portion of the masking layer at the device layer. The method includes etching the wafer along the portion of the masking layer that has been removed to create a crystal facet surface that is oriented at a tilt angle. The method includes epitaxially growing a tip along the crystal facet surface. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2610040-C1 |
| priorityDate |
2012-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |