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publicationDate 2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8535782-B2
titleOfInvention Resin sheet for circuit board and production process therefor
abstract A resin sheet ( 100 ) is provided with a resin layer ( 120 ), and a passivation layer ( 110 ) laminated on one surface of the resin layer ( 120 ). The resin sheet ( 100 ) has a rectangular shape in a plan view. The periphery of the passivation layer ( 110 ) extends outward from the periphery of the resin layer ( 120 ). The resin layer ( 120 ) is provided with a flat section ( 121 ), and a slope section ( 122 ) wherein the thickness of the resin layer ( 120 ) gradually reduces toward the outside from the flat section ( 121 ). A difference between the resin thickness (d) of the boundary section ( 123 ) between the slope section ( 122 ) and the flat section ( 121 ) of the resin layer ( 120 ), and an average thickness (D) of the flat section ( 121 ) is 5% or less of the average thickness (D).
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