| abstract |
Composition comprising (A) 50-99.5 wt %, based on the total weight, of A, B and C of a reaction resin or reaction resin mixture that is processed into thermosetting materials, said resin or resin mixture being liquid at temperatures in the range of 15 to 100° C. and having an average molecular weight of 200 to 500,000 and with a sufficient number of suitable reactive groups for a curing process and (B) 0.5-50 wt %, relative to the total weight of A, B and C of one or more dispersed polyorganosiloxanes that are contained in the reaction resin or reaction resin mixture homogeneously in finely distributed form as polyorganosiloxane droplets with a diameter of 0.001 to 4 μm, wherein the organopolysiloxane particle is a polymer of the general formula (R 3 SiO 1/2 ) W (R 2 SiO 2/2 ) X —(RSiO 3/2 ) Y —(SiO 4/2 ) Z , where w=0 to 20 Mol %, x=80 to 99.9 Mol %, y=0.5 to 10 Mol %, z=0 to 10 Mol %, (C) 0.1-50 wt %, based on the total weight of A, B and C of one or more silicone organo copolymers as dispersing agents that can be homogeneously dissolved or homogeneously emulsified in the reaction resin or reaction resin mixture. |