http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8506712-B2

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67306
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00
filingDate 2008-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55830dffee18f7181dbdca6178ee6262
publicationDate 2013-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8506712-B2
titleOfInvention Wafer support jig, vertical heat treatment boat including wafer support jig, and method for manufacturing wafer support jig
abstract The present invention provides a wafer support jig having at least a support surface on which a treatment target wafer is mounted and supported when performing a heat treatment, wherein skewness R sk on the support surface that supports the treatment target wafer is 0<R sk <10, and 10 0 to 10 5 protruding objects each having a height of 2 μm or above and less than 30 μm are present within arbitrary 1 mm 2 without protruding objects each having a height of 30 μm or above on the entire support surface. As a result, it is provided a wafer support jig that can reduce friction or adhesion of a support surface of the wafer support jig and the wafer when performing a heat treatment to the treatment target wafer such as a semiconductor wafer in a vertical heat treatment furnace, has an appropriate size distribution of the protruding objects on the support surface, and can suppress occurrence of slip dislocation, and to provide a vertical heat treatment boat including this wafer support jig, and a method for manufacturing the wafer support jig.
priorityDate 2007-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.