| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd0c8fdc9e4bb6f5a84b77ad315f3bde
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac3dec9ee17f1476134e4a71b4a2f894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48cdad2db90816cad9f42f29e3599510
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc6cbc6b221838d8c8f2c3654cc7b637
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9426caf63d13ae030efeb071a21aa231 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2010-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b52d2ff57980b4573913e7b238b4bb3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7da578f5d3c2957f0f38300ae007d10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab9b956e5c250974895186c59a2665d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0cbe4f253eb505714031c52bad11a45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_828c160af3f8b1324c29a1bc416c57b4 |
| publicationDate |
2013-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8470631-B2 |
| titleOfInvention |
Method for manufacturing capped MEMS components |
| abstract |
A simple and economical method for manufacturing very thin capped MEMS components. In the method, a large number of MEMS units are produced on a component wafer. A capping wafer is then mounted on the component wafer, so that each MEMS unit is provided with a capping structure. Finally, the MEMS units capped in this way are separated to form MEMS components. A diaphragm layer is formed in a surface of the capping wafer by using a surface micromechanical method to produce at least one cavern underneath the diaphragm layer, support points being formed that connect the diaphragm layer to the substrate underneath the cavern. The capping wafer structured in this way is mounted on the component wafer in flip chip technology, so that the MEMS units of the component wafer are capped by the diaphragm layer. The support points are then cut through in order to remove the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9890038-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9758368-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9327965-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9862594-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10508026-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11174154-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10280074-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9580302-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9266717-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015360934-A1 |
| priorityDate |
2009-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |