| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5af8d3c7bc10bb1086b9e8b08769b5d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4f6a1668d8eeea24b49803185cd73d28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24994 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-04 |
| filingDate |
2008-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2735773222ad4de66e39a6d90b62a92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_792c017f9e08a9c4a94b9bf58fa69c6f |
| publicationDate |
2013-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8465837-B2 |
| titleOfInvention |
Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board |
| abstract |
Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R 1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104183567-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104183567-B |
| priorityDate |
2007-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |