Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d380ea394238f732e0ab98fa00bad429 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e724e0a99311dfbb69ce6339d75269b3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ad355ca1e07c3a67ef5a9290bf46806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b4c6a48a8131bda997cd9598d1c89c7f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6e52babe2704645c0c6d9c11197d34e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68354 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0231 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-17 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77218102017b2c0063854db07b88cdfb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c083ce0d28e01b86e2f5ca5c808099ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a331ddc3b63cfc4a617c7d550ac983a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf8e8a8c1bc9cf16bae0319b34998942 |
publicationDate |
2013-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8426960-B2 |
titleOfInvention |
Wafer level chip scale packaging |
abstract |
A method for making back-to-front electrical connections in a wafer level chip scale packaging process is disclosed. A wafer containing a plurality of semiconductor chips is mounted on a package substrate. Each semiconductor chip in the plurality includes one or more electrodes on an exposed back side. Scribe lines between two or more adjacent chips on the wafer are removed to form relatively wide gaps. A conductive material is applied to the back side of the semiconductor chips and in the gaps. The conductive material in the gaps between two or more of the chips is then cut through leaving conductive material on the back side and on side walls of the two or more chips. As a result, the conductive material provides an electrical connection from the electrode on the back side of the chip to the front side of the chip. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9159624-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9406646-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013105977-A1 |
priorityDate |
2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |