http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8415807-B2

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filingDate 2010-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8afa75781102e91c3977e6f4e59bc6d0
publicationDate 2013-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8415807-B2
titleOfInvention Semiconductor structure and method for making the same
abstract The present invention relates to a semiconductor structure and a method for making the same. The method includes the following steps: (a) providing a first wafer and a second wafer; (b) disposing the first wafer on the second wafer; (c) removing part of the first wafer, so as to form a groove; (d) forming a through via in the groove; and (e) forming at least one electrical connecting element on the first wafer. Therefore, the wafers are penetrated and electrically connected by forming only one conductive via, which leads to a simplified process and a low manufacturing cost.
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priorityDate 2009-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.