| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4c68bc20cc1c25aefdc44c29a2636a13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3b052147b39bc1ffc483ed307cdf5ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-547 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-0011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0352 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2008-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_885f1500f9f53f3a870d79660f5b5ee4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afbf0b0bc989ee5f86ed2f4e323dc7e3 |
| publicationDate |
2013-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8389320-B2 |
| titleOfInvention |
Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell |
| abstract |
In accordance with the present invention, the dividing grooves 8 are formed so as not to be parallel to cleavage planes of the semiconductor substrate 1 , and the semiconductor substrate 1 is bent along the dividing grooves 8 , whereby the semiconductor substrate 1 is fractured along the dividing grooves 8. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8513047-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013084671-A1 |
| priorityDate |
2007-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |