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filingDate 2011-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_690d91f9434feeadae30c1309f00ea63
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publicationDate 2013-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8377768-B2
titleOfInvention Structure and fabrication of like-polarity field-effect transistors having different configurations of source/drain extensions, halo pockets, and gate dielectric thicknesses
abstract A group of high-performance like-polarity insulated-gate field-effect transistors ( 100, 108, 112, 116, 120 , and 124 or 102, 110, 114, 118, 122 , and 126 ) have selectably different configurations of lateral source/drain extensions, halo pockets, and gate dielectric thicknesses suitable for a semiconductor fabrication platform that provides a wide variety of transistors for analog and/or digital applications. Each transistor has a pair of source/drain zones, a gate dielectric layer, and a gate electrode. Each source/drain zone includes a main portion and a more lightly doped lateral extension. The lateral extension of one of the source/drain zones of one of the transistors is more heavily doped or/and extends less deeply below the upper semiconductor surface than the lateral extension of one of the source/drain zones of another of the transistors.
priorityDate 2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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