http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8361848-B2

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publicationDate 2013-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8361848-B2
titleOfInvention Precise resistor on a semiconductor device
abstract A method includes forming a polysilicon layer on a substrate; and patterning the polysilicon layer to form a polysilicon resistor and a polysilicon gate. A first ion implantation is performed on the polysilicon resistor to adjust electric resistance of the polysilicon resistor. A second ion implantation is performed on a top portion of the polysilicon resistor such that the top portion of the polysilicon resistor has an enhanced etch resistance. An etch process is then used to remove the polysilicon gate while the polysilicon resistor is protected by the top portion.
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