| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88d0d8c9df217849dce3ef1121a5e253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f7d1b55c7e1b2467b3fa0fba7e9ffc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e04e6192e88ab02c1c0876a8cb26a45b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8193d40a588991a318ae3334342c077d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8268e9c1bb1859edb16678e02dd21af |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-103 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 |
| filingDate |
2011-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a129ec80d23688e3525a2b9035075c9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_007c2560638139b5a24ac137f894dda2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e44a170af50a154aa92a00e4eb356ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cce0081639c8c8512d41faa8be61dc4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_814f0a6e54b35a70566ee08617698090 |
| publicationDate |
2013-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8349538-B2 |
| titleOfInvention |
Photo-curable and thermo-curable resin composition, and a dry film solder resist |
| abstract |
The present invention relates to a photo-curable and thermo-curable resin composition and a dry film solder resist making it possible to provide the dry film solder resist having superior heat-resistance and dimensional stability while exhibiting improved alkali developing properties. The resin composition may comprise an acid-modified oligomer having carboxyl group (—COOH) and photo-curable functional group; a photo-polymerizable monomer comprising a compound having a structure that three or more functional epoxy-acrylate groups are bonded to a heterocyclic structure containing nitrogen, and a functional group having carboxyl group is bonded to at least one epoxy-acrylate group; a thermo-curable binder having thermo-curable functional group; and a photo-initiator. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9880467-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015205202-A1 |
| priorityDate |
2010-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |