Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee49355185affb3c394cf5e65d8c282a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14856696f8d8e92159f33aa63e34d1e9 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-025 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-16 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-16 |
filingDate |
2009-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2012-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4dd38f92cf2f6025e6937830001510e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b230f79794bddc53452ed2cb16bede4f |
publicationDate |
2012-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8293831-B2 |
titleOfInvention |
Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
abstract |
Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C.; a thermally conducting filler having a thermal conductivity of at least 5 W/mK, for instance CaF 2 powder; and at least one hyperbranched polyesteramide having terminal hydroxy groups; and molded articles made therefrom. |
priorityDate |
2008-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |