http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8268535-B2

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00eeaf1029b145bf8124e008dfa7d33f
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0035
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26
filingDate 2011-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2012-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_693d3abbcc50d96cd573e3940d8c8cab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0a702c534b67117ea8287e41a64ff9e
publicationDate 2012-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8268535-B2
titleOfInvention Pattern formation method
abstract After forming a lower layer film, an intermediate layer film and a first resist film on a substrate, a first resist pattern is formed by performing first exposure. Then, after a first intermediate layer pattern is formed by transferring the first resist pattern onto the intermediate layer film, a second resist film is formed thereon, and a second resist pattern is formed by performing second exposure. Thereafter, a second intermediate layer pattern is formed by transferring the second resist pattern onto the intermediate layer film. After removing the second resist film, the lower layer film is etched by using the second intermediate layer pattern as a mask, so as to form a lower layer pattern.
priorityDate 2007-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002059557-A1
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Total number of triples: 28.