http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8268156-B2

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26e1a60eb79e67e1367183a841788c93
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-02
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
filingDate 2011-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2012-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09df5549222884ca7640a0b0827b54b2
publicationDate 2012-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8268156-B2
titleOfInvention Multi material secondary metallization scheme in MEMS fabrication
abstract Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primary metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9533376-B2
priorityDate 2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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