| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_29a902f295f13d3f78f6f6ca839b42ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_216b3c08fbf4839fbf9f3f86a912e268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_db01ddda2dca1d7bbc7189fff018efdb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1b20ea4f831913398ee4b6c8a81516cb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49537
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61H33-0091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F04D13-024 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate |
2010-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc931e61092c3f17e9ffb8a35036a5e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1c6e359823790511f19e6390287afc3 |
| publicationDate |
2012-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8242588-B2 |
| titleOfInvention |
Lead frame based ceramic air cavity package |
| abstract |
A ceramic semiconductor package provides for being surface mounted on a printed circuit board or other mounting surface. A ceramic frame is directly attached to a lead frame to define a cavity in which the base of a semiconductor device is mounted to the portion of the lead frame exposed at the bottom of the cavity. Interface terminals of the semiconductor device are attached to electrical contacts on the ceramic frame inside the cavity. The ceramic package provides a hermetic insulated path through which the signals can be routed from the device to the external leads. Additionally, because the semiconductor device is directly attached to the lead frame, power dissipation, i.e., heat dissipation, is more effectively provided by this direct connection without intervening layers of ceramic or conductor. |
| priorityDate |
2009-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |