| abstract |
An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member ( 1 ) is used which comprising at least five layers including first metal layers ( 11 ) having good thermal conductivity and second metal layers ( 12 ) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers ( 11 ), the first metal layers ( 11 ) and second metal layers ( 12 ) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer ( 11 a ) being thicker than that of the lowermost and uppermost layers. Accordingly, heat generated from the electronic component ( 5 ) can be dissipated well to the outside, and a coefficient of thermal expansion of a mounting portion ( 1 a ) can be brought close to that of the electronic component ( 5 ) or the like. |