| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_414bdb4a72417b346cafc56bcbf14a6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_525565e838d96d5c6d70b4091b7eca2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_232ad409aacc65318724547d0e930404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47c2cd736cfada5996032ea1adc7fce2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09536 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dd085a7a6e769f5f2c229dcda1e4b9a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56c4fa001674137cc462b842b2415117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75bc3347cc4eef1ed0d3b6ea3afa4d3e |
| publicationDate |
2012-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8232477-B2 |
| titleOfInvention |
Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board |
| abstract |
In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10433432-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017013715-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10966324-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10316182-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019297731-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014291633-A1 |
| priorityDate |
2008-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |