| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40fee5e6c42f74d98347cfd6d2765167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b68093e63cf40f9e136f543f933cab0b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c4c9ce0845499017b83496132c97fdfe |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31725
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c8881e0c0acc3e99b32fbff6cab3d4a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_190dd137189434eea54fe2c86ab231a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15c37b84433ac50b7bd0de5e1ac8f8f5 |
| publicationDate |
2012-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8206832-B2 |
| titleOfInvention |
Photosensitive thermosetting resin composition and flexible printed circuit board |
| abstract |
There is provided a photosensitive thermosetting resin composition of an alkali development type from which it is possible to form a coating film that is halogen-free yet has high-level flame retardancy, has a superior low warpage property after it is cured, is excellent in plasticity, resolution, soldering heat resistance, chemical resistance, and the like, and a flexible printed circuit board using the same. There is provided a photosensitive thermosetting resin composition of an alkali development type and a flexible printed circuit board using the same, the photosensitive thermosetting resin composition including: (A) a resin component having a (meth)acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkali solution; (B) a phosphorus-containing epoxy thermosetting resin component; (C) a photopolymerization initiator; (D) an organophosphorus compound; and (E) a diluent, and having excellent performance in all the properties comparable to those of conventional photosensitive thermosetting resin compositions using brominated epoxy resin and a halogen-based flame retardant, and having an excellent property of not generating hydrogen bromide which has been a problem at the time of the combustion. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016152822-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019094692-A1 |
| priorityDate |
2006-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |