| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_16ebbf2b5f669829588fc45dd1118668
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_da1eca4375b85213141184827378d49f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0733d72d6f47d7827347aa3aa1a988f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d7e29d377ca71855697e48ae6d0d53e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ccca7ad7a1814082c3bd5d0ed11825da |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4763 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ab9955961f170bff5bd90ca7ab610be
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b684a3957486fa16d1daef62d4a673a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9193d804a306d079009c2b5c68e72874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd7cd352490998dc2d70887838c14156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e99bab0bc4ddf9bab7d78b38b84465ac |
| publicationDate |
2012-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8187968-B2 |
| titleOfInvention |
Methods of post-contact back end of line through-hole via integration |
| abstract |
Presented are methods of fabricating three-dimensional integrated circuits that include post-contact back end of line through-hole via integration for the three-dimensional integrated circuits. Another aspect of the present invention includes three-dimensional integrated circuits fabricated according to methods of the present invention. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012205807-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8519461-B2 |
| priorityDate |
2007-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |