| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d206d36c40561a5c5e05d8f60a2c5d2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d0693ed4f2b7b1fab97515ac2f1f311c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1db86f831c3ed7b5f83c6980a8d0dd71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7c4ef165493d69a70527ac6ba11cf015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c38e9d3bfb1fceee97c5f21bfaae752 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6616
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P5-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P5-02 |
| filingDate |
2011-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94d80afecb8414e6d8fab58e85e0f505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a108975c5d46518fd41e286a5f2344e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a607fa78546d69e706f0e081e356f685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6568464a97ca82076c83893b92f0a26 |
| publicationDate |
2012-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8169276-B2 |
| titleOfInvention |
Vertical transmission line structure that includes bump elements for flip-chip mounting |
| abstract |
A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013128467-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8911240-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014273550-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9078347-B2 |
| priorityDate |
2008-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |